Mechanical characterization of nickel plated copper heat spreaders with different catalytic activation surface treatment techniques
Victor C. H. Lim1,2*, Nowshad Amin1, Foong Chee Seng3, Ibrahim Ahmad4 and Azman Jalar2
1Department of Electrical, Electronic and Systems Engineering, Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia.
2Microelectronics Semiconductor Packaging, Institute of Micro Engineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia.
3Freescale Semiconductor (M) Sdn. Bhd., Petaling Jaya, Selangor, Malaysia.
4Department of Electronics and Communication, College of Engineering, University Tenaga Nasional, Kajang, Selangor, Malaysia.
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